From backlight to lighting CSP will welcome the market turning point

As the LED industry has received much attention and is the most controversial technology CSP after experiencing the first two years of tepid, it seems to be welcoming the market turning point. Since 2017, the CSP market has been opened: in addition to the high penetration rate in the TV backlight and flash market, in the field of lighting, some big brand companies also use CSP packaging as the LED industry. Controversial technology CSP seems to be welcoming the market turning point after the first two years of tepid. Since 2017, the CSP market has been opened: in addition to the high penetration rate in the TV backlight and flash market, in the field of lighting, some big brand companies also use CSP packaging technology to produce lighting products, and the recent three-dimensional Optoelectronics' wholly-owned acquisition of Japan's Nitto fluorescent film (CSP raw materials) project has also attracted a lot of attention in the industry. In fact, in the past two years, especially in the mainland market, CSP technology has always faced a slap in the face, and almost all new products and packaging companies are paying attention, but there are not many products that are actually put into the market. Most companies in the LED industry are still on the sidelines of CSP, and believe that there is still much room for improvement in product cost performance. However, CSP supporters believe that due to the advantages of CSP's own gold-free and bracket-free, it will eventually gain an advantage in terms of technology and cost. That is to say, under the background of such a group of fans, CSP has been moving from the past backlight field to the field of automotive lighting, commercial lighting and even general lighting in the context of technological maturity. CSP will become a new outlet for LED lighting. From a technical point of view, CSP not only solves the development of miniaturization of package size and improves heat dissipation, but also simplifies and miniaturizes individual device packages, thereby greatly reducing the material cost of each device; In addition, the development of CSP can save the packaging chain, shorten the industrial chain, reduce the circulation cost, and make the LED price more close to the people. In the lighting industry, CSP has a wide range of applications due to its small size and flexibility. In the field of CSP lighting, the international LED giant's layout speed is significantly faster than mainland manufacturers. Seoul Semiconductor announced that it will start mass production of CSP LEDs in 2015. The company calls it WICOP, a PCB wafer level integrated chip. A new LED designed specifically for general lighting is called WICOP2. Last October, Samsung LED also introduced CSP LED modules with color adjustability and increased compatibility modules. These modules will be mainly used in LED spotlights and downlights. This is also the first time that Samsung has introduced CSP technology into its module products to take advantage of the CSP itself. In particular, the combination of flip chip and phosphor coating technology has reduced the use of traditional metal wires and brackets to achieve a more compact design process. In Taiwan, many chip manufacturers have expanded their CSP layout as a good variety to optimize product structure and accelerate transformation and upgrading. In the new century, it has completely withdrawn from low-end LED lighting since October last year, including LED bulbs and LED tubes, and will focus on high-end CSP (Chip scale Package), FC (Flip Chip) and other high-end products. Although there is still room for improvement in the cost and yield of CSP, it is also impossible to completely replace the traditional SMD in the general lighting application in the next five years, but it does not prevent enterprises from accelerating the product development and marketing of CSP. In the mainland market, at the Guangzhou Guangya Exhibition last year, many LED packaging companies including Guoxing Optoelectronics, Liyang Co., and Stereo Optoelectronics exhibited new CSP products. At the new product launch conference held by Sanan Optoelectronics in April this year, Sanan Optoelectronics also said that in response to the emerging market of CSP, Sanan also developed a dedicated flip chip to support Chinese packaging factories to challenge this promising market. . With the support of Sanan's technology and resources, the domestic packaging factory is breaking the Korean Samsung. Seoul Semiconductor's oligopoly in the CSP market is no longer considered a fear. There is no doubt that CSP is getting hotter, and it has become another weapon for LED lighting companies to seize the market. The cost problem becomes the biggest constraint. On the one hand, LED lighting companies have deployed CSP technology and products. On the other hand, the market has not shown signs of large-scale acceptance of CSP products. In theory, because the CSP package size is greatly reduced, the luminaire design can be more flexible, the structure is more compact and simple, and CSP has more performance advantages than SMD. However, from the application side, the maturity of technology and the cost performance of products are still the key factors that restrict market selection. Xu Jialiang, the assistant application group of Jingyuan Optoelectronics R&D Center, believes that CSP is similar to the development trend of traditional LEDs. For example, 2835, 3030, and 5630 are all used in the backlight field because the conversion speed in the backlight field is fast and mature in this field. It will be applied to other fields. This is a common law in the development of new technology applications in the LED field: from backlighting to lighting, there is no technical problem that can be used for backlighting and not for lighting. Xu Jialiang pointed out that the biggest problem for CSPs entering the lighting field is the high cost. In the field of lighting, it is cost-effective. In the field of backlighting, its cost is not only the simple light, but the cost of the entire design module, so the application speed of CSP is faster. Dr. Zhao Hanmin, CTO of Crystal Energy Optoelectronics, believes that on the one hand, in the field of general lighting, the price of ordinary packaged products has been extremely low, while the CSP products use flip chip, the price is slightly higher; on the other hand, the CSP is small in size. Patches require higher precision, so there is a certain technical difficulty in the patching process. It is understood that CSP is based on flip-chip packaged devices, more than 80% of the device cost comes from flip chip, and the current flip chip market share is relatively low, the whole volume is not large, the cost can not be killed with the front of the positive chip And based on the size of the chip, the price is already bloody, so CSP is more stressful in price competition. The person in charge of Guoxing Optoelectronics also said that the CSP is not obvious for the mature medium-power SMD, whether it is light efficiency or cost performance. At present, the cost competitiveness is weak, and the cost of the front-end equipment brought by the process disruption will take some time. digestion. This is because most of the CSP is based on flip chip, and the yield of flip chip has not yet reached the effect of the packaged chip. At the same time, there are not enough companies producing CSP, the scale effect is not obvious, and the cost has not been reduced to popularity. range. With the continuous improvement of CSP light efficiency, yield and process maturity, the cost reduction of CSP for lighting in the first half of this year is inevitable. Wang Gaoyang, deputy general manager of Hongli Optoelectronics, said. The high-end market will take the lead in breaking the LED lighting industry from the ascendant to the gradual maturity, the discussion of standardization has never stopped. The original LED high-power products were highly homogenized. After the emergence of CSP, they gradually gained certain recognition in the market and the development trend was good. However, as the CSP market has not fully erupted, the products have not yet formed standard specifications. It is understood that the current CSP is mainly used in two major areas: mobile phone flash and TV backlight. At present, Apple and Samsung mobile phone flashes have adopted CSP products across the board. Domestic companies such as Jufei and Jingke also have a place in the flash market. On the other hand, since last year, almost all new TV sets have adopted CSP backlight technology, and the market volume will continue to accelerate. As one of the earliest manufacturers to use flip chip in China, Jingneng Optoelectronics has spared no effort in the research of silicon substrate. At present, it has spared no effort in promoting the progress of CSP, and in 2017, on high-power CSP, such as automotive lighting. There will be considerable progress in commercial lighting for road lighting and dimming. It is worth mentioning that in the first quarter of 2017, Jingneng Optoelectronics CSP's flashlights and lights customers demanded a large supply, and even the phenomenon of short supply. Dr. Zhao Hanmin believes that from the current market application, CSP is mainly a high-end application market with high margins, such as mobile phone flash, automotive lighting, industrial and mining lamps, etc. These products have higher requirements for light extraction angle and uniformity of light color. The single-sided illumination CSP is more suitable for application requirements. Lumileds has opened up the market for mobile phone flash through cooperation with Apple. The iPhone 7 has introduced a flash module with four LEDs, which may double the number of flash LEDs. This also allows CSP manufacturers to see the potential of single-sided CSP in the high-end market. . CSP can make the package simple. Therefore, the packaging company must constantly innovate and adjust, make full use of its mid-stream advantage, and find its own value in the extension of both upstream and downstream. And provide solutions and added value for downstream customers in modular, functional, and intelligent LED applications. It is expected that CSP will usher in a big development opportunity in the field of lighting in 2017, but not all lighting markets, but will be the first to break in the high-end market. In addition, the current industry has reached a consensus: CSP will not replace all the packaging, it will be applied to areas that can play its advantages, lighting may be only a part of it.

We supply all kinds of Bolts,such like 12.9 Grade DIN 912 HEX socket head cap screw half thread,12.9 Grade DIN 912 HEX socket head cap screw FULL thread,12.9 grade ISO 7379 Stripper bolts,parting lock.With competitive price,best quality,fast leadtime and best service,we have supplied those product to many country.We enjoyed good reputation from all of them.

Bolts

Anchor Bolt ,Stainless Steel Bolts ,Lag Bolts,Metric Bolts

Changsha Borun Mould Co. Ltd. , http://www.borunmouldparts.com